21.34印刷电路板标准(中英文对照版)

Printed

circuit

cards

and

components

shall

be

covered

with

conformal

coating

on

both

sides

between

0.003

inch

and

0.007

inch

in

thickness.

provisions

to

preclude

coating

from

entering

sockets shall be taken during the coating process.

印刷电路卡 片和组件应该被两边的保形涂层所覆盖，厚度在

0.003

英寸 和

0.007

英寸之间。进

入套筒的排 除涂料的预备材料应该取自于涂装工艺流程中。

Edge

connectors

and

card

shall

be

keyed

to

prevent

insertion

of

card

in

wrong

position,

and

mounted for ease of card removal and replacement and use of card extenders.

边缘连接器和卡关键在于防止在错误的位置插入卡，

安装要使卡的去除和替换灵活，

还有卡

填充剂的使用。

Printed circuit cards shall have components identified to match component identification as shown

on schematic diagram.

印刷电路卡片应该要有组件匹配识别去认证组件，展示在示意图上。

Group

II:

This

specification

documents

the

requirements

for

all

propulsion,

friction

brake

and

automatic

train

control

logic

printed

wiring

assemblies,

rigid

single-sided,

double-sided,

and

multilayer printed wiring assemblies. Alternate standards may be proposed subject to approval by

the District.

第二 组：

此规范性文件包含对下列的要求：

所有的推进，

电路装配，刚性单面的，双面的和多层的 印刷电路装配。备用标准经机构认同后也可使用。

Single

and

double

sided

circuit

boards

shall

be

designed

in

accordance

with

IPC-D-330.

Fordouble-sided

and

single-sided

printed

circuits

assemblies,

coupons

are

not

required

but

are

strongly recommended especially for large form factor boards. If coupons are provided on these

types

of

boards,

the

artwork

of

the

drawing

for

the

corresponding

assembly

shall

state

that

coupons are required for assembly.

单面或双面电路板须按照

IPC-D-330

来 设计。对于双面或单面印刷电路装配，不要求样片，

但是强烈建议有面板上的大块。

如果此类电板上提供样片，

相应的装配图绘应该说明装配需

要样片。

Multilayer

circuit

boards

shall

be

designed

in

accordance

with

IPC

2221A

and

IPC

2222.

All

multilayer

assemblies

with

more

than

two

layers

shall

include

the

coupon

process

and

no

exceptions shall be made.

多层电路板应该按照

IPC 2221A

和

IPC 2222

来设计 。所有的超过两层的多层集和应包括样

片进程并且不应有例外。

Solder mask shall be a permanent polymer coating in accordance with ANSI/IPC SM-840D and

mask shall be applied to all circuit sides.

阻焊层须是永久性的聚合涂层，

符合

ANSI/IPC SM-840D

要求。

涂层应应用于所有的电板。

Printed wiring circuit board dimensions shall have tolerances per IPC 2615.

印刷电路板尺寸可有根据

IPC 2615

所容许的误差。

Finished boards shall meet the criteria of ANSI/IPC A-600G.

成品板需满足

ANSI/IPC A-600G

的标准。

Assembly of circuit boards shall comply with IPC CM-770E.

电路板集合须符合

IPC CM-770E

标准。

Completed assemblies shall meet the criteria of ANSI/IPC A-610D.

完成的集合须符合

ANSI/IPC A-610D

标准。

21.35.1 General

21.35.1

总则

Printed circuit boards shall be designed, constructed and inspected to IPC-2221A and IPC2222,

unless more stringent requirements are noted here. Traces shall be made as wide aspractical, with

the minimum width being based on a 10oC temperature rise.

印刷电板应该按

IPC -2221A

和

IPC 2222

设计，构造，检验，除非在此注明更严格的要求。

Circuit

board

material

shall

be

per

IPC

4101B,

latest

revision,

with

a

minimum

thickness

of

1/16-inch using type GB or GH base material. Type GE material may be used for boards which

haveno components whose power dissipation is greater than 2 watts and when said board is not

mounted

adjacent

to

components

dissipating

greater

than

2

watts.

The

copper

laminate

shall

be

firmly attached to the board and shall be resistant to blistering and peeling when heated with a

soldering iron.

电路板材料应根据最新的修订版

IPC 4101B

使用

GB

或

基材类型，

最小厚度为

1/16

英

寸。

GE

类的材料可用做电板，没有功耗大于

2

瓦的部件，并且 与功耗大于

2

瓦的部件相邻

是，

上述电板不应安装。

铜板也须牢固地附在电板上，

并且用烙铁加热时，

应耐气泡和剥落。

Components with pins shall be mounted only on one side. Connections shall be made to the other

side or internal layers via plated through holes. SMT devices may be mounted on both sides if part

of an approved existing design.

带钉子的部件只能在一面安装。

< br>通过镀版穿孔，

能连接到另一面或里层。

如果有现行的可 支

持的设计，超小电子管设备安装在两面。

All circuit boards shall be inherently stiff or shall be reinforced to prevent damage due to

vibration

or

handling.

Circuit

boards

larger

than

100

in2

shall

be

centrally

stiffened

unless

otherwise approved. < /p>

所有的电路板须本身坚固，并且须增强来减轻由于摇晃和装卸损害。

All

printed

circuit

boards

with

the

same

function

shall

be

interchangeable

between

equipment

groups without additional adjustment.

所有的有相同功能的印刷电路板须在 设备组可更换，不需额外调整。

All Printed Circuit Boards shall be of the “plug

-

in” type, with positive support against vibration,

except where approved otherwise.

印刷电路板应当属于

“

插件程序

”

类型，有积极的抗震动支持。

Printed

circuit

boards

(PCBs)

shall

be

mounted

with

positive

retention

by

keeper

bars

unless

otherwise

approved.

PCBs

mounted

in

the

vertical

plane

shall

have

retaining

mechanisms

and

shall

be

simple,

easily

applied/removed

without

tools

and

shall

remain

attached

to

the

card

shall be fully inter-changeable without adjustment by the use of digital circuits, stable

components, and tight tolerance components as applicable. Potentiometers shall not be permitted.

Select on test resistors shall not be used. All electronic control units, PCBs, majorcomponents and

assemblies shall be serialized and contain a bar code label.

印刷电路板（

PCBs

）应用衔铁条作 以良好的固位，除了没被批准的。安装在垂直面的

PCBs

应当 有一个固定的机制而且简单易操作或不用工具就能拆下，并且应当依附于插件板导轨。

PCBs

应当能完全地互相转变而不借助数字电路，稳定的元件 ，及紧密度容限元件。不允许

使用电位器。不应选用正在测试的电阻器。所有的电子控制 元件，

PCBs

，主元件和装置应

该被 序列化，并且包含条形码标记。

The Supplier, if invoking Directive 2002/95/EC on Restriction of Hazardous Substance (RoHS)

and

if

intends

to

use

lead-free

soldering

techniques,

shall

provide

an

in-process

plan/procedure

that

mitigates

all

possibilities

that

“tin

whiskers”

(small

hairs

that

peel

off

the

tin

and

cause

shortcircuits) can occur during the manufacturing of all PCBs and/or related assemblies requiring

soldering to the District for review and approval.

供应厂商， 如果援引危害物质禁用令

2002/95/EC

并且想使用无铅 的焊接技术，应该提供一

个同进程的计划或步骤给区域进行重审和核准，

这个计划或步骤能减少

“

锡晶须

”

（从锡上剥

离的小体毛且能引起短路）在所有

PCBs

生产或有关的要求焊接的组装过程中产生

.

21.34.2

Marking

21.34.2

标注

All

circuit

boards

shall

be

labeled

with

a

part

number,

serial

number,

and

descriptive

nomenclature.

所有的电路板应该用零件号码，编号和描写性的术语表明。

All components shall be labeled on the board with component drawing references and such other

information as may be required to repair and troubleshoot the board. The component and wiring

sides of the board shall each be marked to indicate capacitor and diode polarity, and at least two

leads or one lead and a graphic symbol indicating orientation of all transistors and thyristors.

所有的元 件都应在电板上用图示标明，

那样的信息用以电板的修复、

故障 排解。

元件和电板

的反面应各自做上标记来表明电容器，

二极管，

至少有两根或一根导线和一个图形符号指明

< br>所有晶体管和晶体闸流管的方向。

Integrated circuits and other multi- terminal devices shall have an index mark on the component

side of the board, visible with the component inserted, to indicate proper keying and insertion;the

first pin on all IC packages shall be identified on the wiring side of the board.

集成电路和和其他的终端设备在安装着元件的 电板那面应有一个指标，

在插进去的元件上能

看到，