印制电路板各工序缺陷中英文一览

各工序缺陷中英一览表

Inner layer dry/film

内层干菲林

Blocking boards

Inner scrap

Soft inner

Inner misregistration

Inner short

Inner open

Inner slight short

Pressing

压板

DRY PLY

Tg value out of spec.

Tg value not meet the requirement

Dent

Measling

Poor edge

Burrs on board edge

Resin shortage in board edge

Fibre in board edge

Thin board thickness

Excess board thickness

Board out of spec.

Lamination wrinkles

Lamination blisters

Rough board surface

Board surface extrusion

Dent by pressing board

Board warp/bow

Board small

Protective film too thick or thin

Delamination

Peel strength under requirement

Black oxide scratch

Layer structure not meet MI

requirement

Poor dimensional stability

Delamination/Blister

Poor cutting

Guide hole over size

Guide pin shift

Guide hole shift

Poor black oxide

Board slip in pressing

Foreign material in laminate

Joint glue too thick or thin

Unqualified dielectric layer

卡板

内层报废

内层变软

内层错位

内层短路

内层开路

内层微短

DRY PLY

Tg

超出要求

Tg

达不到要求

凹折

白斑

板边不良

板边毛刺

板边缺树脂

板边纤维丝

板薄

板厚

板厚不合要求

板料布纹

板料气泡

板面不光滑

板面突起

板面压伤

板弯

/

曲

板小

保护膜偏厚

&

偏薄

爆板

剥离强度未达标

擦花黑化

层压结构不符

MI

要求

尺寸稳定性未达标

分层

/

起泡

割板不良

管位大孔

管位钉打偏

管位歪孔

黑化不良

滑板

基材内异物

接着剂偏厚

&

偏薄

介电层不合格

Lack copper

Uncomplete tearing film

Conductor lift

Bulge on conductor

Poor conductor

Pattern misregistration

Elliptical hole

Inner shift

Inner hole position incorrect

Lay up in reverse

The incision length not meet

the requirement

Board poor cutting

Burnt

The resin content lower than

the requirement

Void in resin

Dissipation factor beyond

criteria

Make wrong guide hole

Thinner copper thickness

Dlamination between surface

copper and prepreg

Bow and twist out of spec

Dusty and damage

Absorption beyond criteria

Construction of fiber not meet

requirement

Pressing dent

Poor lamination

Failed pressure vessel test

Fracture

Oxide

Misuse prepreg

Laminate misused

Misuse inner P/R

Misuse Cu coil

Weave texture

Wrinkles

Marked legend shift

Marked legend in unit

Stain on board

Bow

Copper clad thickness under

spec.

Copper clad thickness over

spec.

Drilling wrong guide hole

Inner layer cu thickness under

spec.

少铜

撕膜不净

崩线

线路凸位

线路不良

线路图形歪

椭圆孔

内层偏位

内层歪孔

排反板

切割长度达不到要

求

切坏板

烧焦

树脂含量低于要求

树脂空洞

损耗因子达不到要

求

挑错管位

铜箔偏薄

铜箔气泡

弯曲性超标

污损

吸水性超标

纤维结构不符要求

压板凹痕

压板不良

压力锅测试未达标

压伤

氧化

用错

P

片

用错板料

用错内层

P/R

用错铜箔

织纹显露

皱折痕

字唛打偏

字唛入单元

板面污渍

板弯

表面铜薄

表面铜厚

打错管位

内层铜薄

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各工序缺陷中英一览表

Thin dielectric layer thickness

Excess dielectric layer

Electronic inductivity beyond

standard

Cutting wrong laminate

Missing guide hole

Missing black oxide

Exposed/Disrupted fibres

Routing guide hole shift

Pits

Inner white spot

Improper inner layer

Inner scratch

Inner pink ring

Inner glue residue

Drilling

钻房

Broken guide hole

Drill bit broken

Scrape

Deformed hole

Burrs in hole

Drilling skip

Drilling wrong boards

Drilling wrong hole

Tenting hole/Plugging

PTH/PP

沉铜

/

板面电镀

Board surface dent

Board surface copper nubbles

Board folding and breaking

Poor plating

The plating thickness not uniform

Rough plating

Hole plugged by plating

Burnt board by plating

Boards-drop into the tunnel

Burrs on hole-edge

Rough hole wall

Hole black

Missing hole of mechanical

drilling

Dry/Film

干菲林

Hole breakout

Film scratch

Scratching prevent tin

Under developing

Over developing

Broken dry film

Overlap boards

介电层偏薄

介电层偏厚

介电常数未达标

开错料

漏打管位

漏黑化

露纤维

/

纤维断裂

锣偏管位孔

麻点

内层白点

内层不配套

内层擦花

内层粉红圈

内层胶渍

打爆管位

断针

刮花

孔变形

孔内披锋

漏钻孔

钻错板

钻错孔

塞孔

板面凹痕

板面铜粒

板折坏

电镀不良

电镀层不均匀

电镀粗糙

电镀塞孔

电镀烧板

缸底板

孔边毛刺

孔粗

孔黑

机械钻漏孔

崩孔

擦花菲林

擦花锡面

冲板不净

冲板过度

穿菲林

叠板

Inner layer cu thickness over

spec.

Foreign material in inner

layer

Length and width not meet

spec.

Marking wrong

Missing marking

Poor staff

Poor marking

Board break

The joint of copper foil

Skipping inner-layer

Skipping prepreg

Pattern perforation

Poor mechanical pressing

Hole diameter over size

Drilling extra hole

Drilling in reverse

Poor drilling

Drilling un-through

Drilling hole misalignment

Hole diameter under size

Hole damaged

Copper thread in hole

No copper in hole

Copper in hole

（

NPTH

）

Board damaged by scrubbing

Plating copper peel off

Wicking

Drilling hole failure

Board scratched by machine

Mechanical drilling hole

misalignment

Poor mechanical drilling

Big hole of mechanical

drilling

Extra hole of mechanical

drilling

Glue residue

Missing PAD

Missing date code

Poor in D/F lamination

Poor exposure

Exposure foreign material

Bleeding copper plating

(wicking)

内层铜厚

内层杂物

外围尺寸不符合要

求

打错字唛

漏打字唛

板料不良

打字唛不良

板裂

铜箔接口

少排内层

少排

P

片

线路穿孔

机械压伤不良

钻大孔

钻多孔

钻反孔

钻孔不良

钻不穿

钻歪孔

钻小孔

钻炸孔

孔内铜丝

孔内无铜

孔内有铜

< br>(

非镀铜

孔

)

磨坏板

铜层剥离

渗铜

钻飞孔

机械刮伤

机械钻歪孔

机械钻孔不良

机械钻大孔

机械钻多孔

胶渍

漏

PAD

漏印周期

辘菲林不良

曝光不良

曝光垃圾

渗镀

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