questions-anf
IPC-A-6
10
国际规范中英文对照
4.6.2 Heat sink-Contact
散热片<
/p>
――
接触片
arget-Class 1,2,3
目标——等级
1,2,3
· Component and heatsink are in
full contact with the
mounting surface.
组件和散热片与安装表面完全
接触
· Hardware meets specified
attachment requirements.
部件满足规定的接触要求。
Figure
图
4-64
1. Heat sink
散热片
Acceptable-Class 1,2,3
可接受的——等级
1,2,3
· Component not flush.
组件不平齐
· Minimum
75% contact with
mounting surface.
至少有
75%
与安装表面接触
< br>
·
Hardware
meets
mounting
torque
requirements if
specified.
如果有规定,部件满足安装的转距要求
Figure
图
4-65
1. Gap 2. Heat sink
间隙散热片
Defect-
Class 1,2,3
缺点——等级
1,2,3
· Component is not in
contact
with mounting surface.
组件没有接触到安装表面
·
Hardware is loose and can be
moved.
部件松弛可以移动。
Figure
图
4-66
1. Heat sink 2. Gap
散热片间隙
5.1
Orientation
方向
5.1.1 Orientation-Horizontal
方向——水平
Target-
Class 1,2,3
目标——等级
1
,
2
,
3
?Components are centered
between their lands.
组件位于焊盘中央
?Component markings are
discernible.
组件标识清晰可见
?Nonpolarized components are
oriented so that
markings
all read the same way (left-to-right
or
top-to-bottom).
Figure
图
5-1
无极性组件的方向应使其标识
都能按同样方式进行辨识
(从左到右或从上到下)
Acceptable-
Class 1,2,3
可接受的——等级
1
,
2
,
3
?Polarized and multilead
components are oriented
correctly.
有极性和多引脚的组件应按正确
方向安装。
?When hand
formed and
hand-inserted, polarization
symbols are discernible.
当手工成型及手插件时,极性符号可以辨识。
?All components are as specified and
terminate to
Figure
图
5-2
correct lands.
所有组件都符合规定并连接到
正确的焊盘上。
?Nonpolarized
components
do
not
need
to
be
oriented
so
that
markings
all
read
the same way(left-to right or top to-bottom).
无极性的组件不需要按同样的方向,
只要标识可按相同方向辨识即可
p>
(从左到右
或从上到下)
.
5.1.1 Orientation-Horizontal(cont.)
方向——水平(续)
Defect-
Class 1,2,3
缺点——等级
1
,
2
,
3
?Component is not as specified
(Wrong part).
组件不符合规定(组件错误)
?Component not mounted in
correct holes.
组件没有安装在正确的孔中。
?Polarized component mounted
backwards.
有极性组件安装方向相反。
?Multileaded component not oriented
correctly.
Figure
图
5-3
多引脚组件的安装方向不正
确。
5.1.2 Orientation-Vertical
方向——垂直
Target-
Class 1,2,3
目标——等级
1
,
2
,
3
?Nonpolarized comp
onent
markings read from the top
down.
无极性组件的标识可以从上至
下辨识
?Polarized markings are
located on top.
极性标识位于顶部
.
Figure
图
5-4
Acceptable-Class 1,2,3
可接受的——等级
1
,
2
,
3
?Polarized
part
is
mounted
with
a long ground lead.
极性组件安装时有长的接地引脚
?Polarized marking hidden.
极性标识被隐藏起来
?Nonpolarized component
markings read from bottom to
top.
无极性组件标识可以从底至上辨识。
Figure
图
5-5
Defect-Class 1,2,3
缺点——等级
1
,
2
,
3
?Polarized
component
is
mounted
backwards.
极性组件安装反向。
Figure
图
5-6
5.2 Mounting
安装
5.2.1
Mounting-Horizontal-Axial
Leaded-Supported Holes
安装——水
平——轴向引脚——有
支撑孔
Target-Class 1,2,3
目标——等级
1
,
2
,
3
?The entire body length of the
component is in
contact with
the board surface.
整个组件本体长度与线路板表面完全接触
?Components required to be mounted off
the board are ,at least
1.5mm[0.059
in]from the board surface
。
e.g., high heat dissipating.
需要离开线路板表面安装的组件至少要离开线路板
Figure
图
5-7
平面
1.5mm
(
0.059
in
)
,如高散热<
/p>
器件
.
Figure
图
5-8
5.2.1
Mounting-Horizontal-
Axial
Leaded-Supported Holes(cont.)
安装——水平——轴对称引脚—
—有支撑孔
Acceptable-Class 1,2
可接受的——等级
1
,
2
,
3
?The
maximum
space
between
the
component and the
board
surface does not violate the requirements for
Figure
图
5-9
((H) is a
lead protrusion(see 5.2.7)or
component height(H).
user-determined dimension.)
组件与线路板平面之间的最大间距不应违反引脚突出(见
5.2.7
)或组件
高度(
H
)的要求。
p>
(高度(
H
)是由使用者决定的尺寸)
p>
Process Indicator-Class 3
程序指示——等级
3
?The
farthest
distance
between
the
component
body
and
the
board(D)
is larger than
0.7mm[0.028 in].
组件本体与线路板之间的最大的距离(
D
)超过
0.7mm
(<
/p>
0.028
in
)
。
Defect-Class 1,2,3
缺点——等级
1
,
2
,
3
?Components
required
to
be
mounted
above
the
board
surface
are
less
than 1.5mm[0.059 in]
要求离开线路板
表面安装的组件与线路板的距离小于
1.5mm
(
0.059
in
)
.
5.2.2
Mounting-Horizontal-Axial
Leaded-Unsupported Holes
安装—
—水平——轴向引
脚——无支撑的孔
Target-Class 1,2,3
目标——等级
1.2.3
?The entire body length of the
component is in
contact with
the board
surface.
整个组件本体长度与线路板表面完全接触
.
?Components required to be mounted off
the board are
at minimum
1.5mm[0.059 in] from the board
Figure
图
5-10
surface
。
e.g. ,high heat
dissipating.
Plating in
barrel
需要离开线路板表面安装的组件至少
要离开线路板平
孔壁上没有电镀面
1.5mm
(
0.059
in
)
,如高散热器件
.
Components required to be
mounted off the board are provided with lead
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