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作者:高考题库网
来源:https://www.bjmy2z.cn/gaokao
2021-02-22 18:30
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2021年2月22日发(作者:瑞兽)



AA


AA


ABS


AC


AC


ACA


ACC


ACCU


AEC


Agc


AGR


AGV


AI


AIS


ANOVA


ANSI


AOI


AOQ


APT


AQL


ARINC


ASCII


ASIC


ASME


ASPaRC


ASQ


ASTM


ATE


ATG


Antenna Array


Automatic Acknowledge


Acrylonitrile-Butadiene- Styrene(Plastic)


All Call


Alternating Current


Anisotropically Conductive Adhesive


Advanced Concept Construction Active Control Channel


Alternating Current Connection Unit


Architecture, Engineering And Construction


Automatic Gain Control


Annual Average Growth Rate


Automated Guided Vehicle


Artificial Intelligence


Adhesive Interconnect System


Analysis Of Variance


American National Standards Institute


Automated Optical Inspection


Average Outgoing Quality


Automatically Programmed Tools


Acceptable Quality Level


Aeronautical Radio Incorporated


American Standard Code For Information Interchange


Application Specific Integrated Circuit


American Society Of Mechanical Engineers


Ability Of Solder Paste To Retain Components


American Society For Quality


American Society For Testing And Materials


Automatic Test Equipment


Automatic Test Generation


ATR


AVT


AWG


AXI


BC


BDMA


BGA


BITE


BOD


BOM


BOT


BT


BTAB


C&E


C3


C4


CAD


CAE


CAF


CAFM


CAGE


CALS


CAM


CAPP


CAR


CASE


CAT


CBGA


CCAPS


CDA


Air Transport Rack


Accelerated Vesication Test


American Wire Gauge


Automated X-Ray Inspection


Buried Capacitance


Benzyldimethylamine


Ball Grid Array


Built-In Test Equipment


Biochemical Oxygen Demand


Bill Of Material


Build To Order


Bismaleimide Triazine


Bumped Tape-Automated Bonding


Cause And Effect


Command,Control And Communicate


Controlled Collapse Component Connection


Computer-Aided Design


Computer-Aided Engineering


Cathotic Anionic Filaments


Computer-Aided Facilities Management


Commercial And Government Entity


Computer-Aided Acquisition And Logistic Support(DOD)


Computer-Aided Manufacturing


Computer-Aided Process Planning


Computer-Aided Repair


Computer-Aided Software Engineering


Computer-Aided Testing


Ceramic Ball Grid Array


Circuit Card Assembly And Processing System


Copper Development Association


CEPM


CET


CFM


CFM


CIM


CISC


CITIS


CM


CMC


CMOS


CNC


COB


COD


COT


Cp


CPL


CPLD


CPU


CPU


CRC


CRT


CSA


CSG


CSP


CTE


CVS


DAB


DATC


DBMS


DC


Certified Ems Program Managers


Certified Electronic Technician


Continuous Flow Manufacturing


Cubic Feet Per Minute


Computer-Integrated Manufacturing


Complex Instruction Set Computing


Contractor Integrated Technical Information Services


Contract Manufacturer


Copper Moly Copper


Complimentary Metal-Oxide Semiconductor


Computer Numerical Control


Chip-On-Board


Consumed Oxygen Demand


Configure To Order


Capability Performance


Capability Performance, Lower


Complex Programmable Logic Device


Capability Performance, Upper


Central Processing Unit(Computer)


Cyclic Redundancy Check


Cathode-Ray Tube


Canadian Standards Agency


Constructive Solids Geometry


Chip Scale Package


Coefficient Of Thermal Expansion


Cyclic Voltammetry Stripping


Designated Audit Body


Design Automation Technical Committee (Ieee)


Database Management System


Direct Current


DCAS


DCMA


DCMC


DESC


DFM


DIM


DIN


DIP


Dk


DLA


DMA


DMS


DMSA


DNC


DOD


DOD


DOE


DOS


DRC


DRM


DS


DSC


DSP


DTP


DTS


DVM


DXF


ECAD


ECC


ECCB


Defense Contract Administration Service


Defense Contract Management Agency


Defense Contract Management Command


Defense Electronics Supply Center


Design For Manufacture


Data-Information Record


Deutsches Institute For Normung


Dual-Inline Package


Dielectric Constant


Defense Logistics Agency (Dod)


Direct Memory Access


Dynamic Mechanical Spectroscopy


Defense Manufacturers And Suppliers Association


Distributed (Or Direct) Numerical Control


Department Of Defense


Dissolved Oxygen Demand


Design Of Experiments


Disc Operating System


Design Rule Check


Drawing Requirements Manual


Double-Sided


Differential Scanning Calorimetry


Digital Signal Processor


Diameter True Position


Dock To Stock


Digital Voltmeter


Data Exchange Format


Electronic Computer-Aided Design


Error Correction Code


Electronic Components Certification Board


ECL


ECM


ECN


ECO


ECR


ED


EDA


EDI


EDIF


EDM


EDO


EIA


EIS


ELD


EMC


EMF


EMI


EMP


EMPF


EMS


ENEPIG


ENIG


ENIPIG


EPA


EPR


EPT


ESD


ESI


ESR


ETPC


Emitter-Coupled Logic


Electronic Countermeasures


Engineering Change Notice


Engineering Change Order


Engineering Change Request


Electrodeposited


Electronic Design Automation


Electronic Data Interchange


Electronic Design Interchange Format


Electro-Discharge Machining


Extended Data Out


Electronics Industry Association


Engineering Information System


Electro-Luminescent Diode


Electromagnetic Compatibility


Electro-Motive Force


Electromagnetic Interference


Electromagnetic Pulse


Electronics Manufacturing Productivity Facility


Electrical Manufacturing Services


Electroless Nickel Electroless Palladium Immersion Gold


Electroless Nickel Immersion Gold


Electroless Nickel Immersion Palladium Immersion Gold


Environmental Protection Agency


Ethylene-Propylene (Copolymer) Resin


Ethylene-Propylene Terepolymer


Electrostatic Discharge


Early Supplier Involvement


Equivalent Series Resistance


Electrolytic Tough-Pitch Copper


FAA


FAR


FCC


FCC


Federal Aviation Administration


Failure Analysis Report


Federal Communications Commission


Flat-Conductor Cable


FC-CBGA


Flip Chip Ceramic Ball Grid Array


FC-PBGA


Flip Chip Platic Ball Grid Array


FCT


FEA


FEM


FEP


FET


FFT


FMEA


FPGA


FPT


FSCM


FTP


GaAs


GBIB


GMA


GTA


GTPBGA


HASL


HPGL


HTE


HTML


HTTP


I/O


IC


ICA


Functional Circuit Test


Finite-Element Analysis


Finite-Element Modeling


Fluorinated Ethylene-Propylene (Teflon)


Field-Effect Transistor


Fast Fourier Transform


Fault Mode And Effect Analysis


Field Programmable Gate Array


Fine-Pitch Technology


Federal Stock Code For Manufacturers


File Transfer Protocol


Gallium Arsenide


General Purpose Interface Bus


Gas Metal Arc (Welding)


Gas Tungsten Arc (Welding)


Glob Top Plastic Ball Grid Array


Hot Air Solder Level


Hewlett Packard Graphic Language


High Temperature Elongation


Hypertext Markup Language


Hypertext Transfer Protocol


Input/Output (Terminations)


Integrated Circuit


Isotropically Conductive Adhesive

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