-
onic
International Limited
A
cceptable Quality Levels
Document
number
﹕
DM-QA-001
Make
date
﹕
18-Sep.-2007
e
﹕
To ensure that
all products of the company can accord with the
request of the client, specially make the
inspection standard.
﹕
Apply this
company all PCB inspection.
3.D
< br>efine
﹕
Critical Defect=CR:
Serious shortcomings
refers to the products caused by poor product is
not able to use, as well as causing fault.
Major Defect=MA:
The
main faults refers to the serious shortcomings of
the shortcomings of their products outside the bad
may
lead to product functional problems
but mesh Not happen before those problems, a
potential hazard of rendering.
Minor Defect=MI
：
Edition
﹕
V1.0
Page
number
﹕
1 of 9
Minor
faults
refers
to
the
product
of
bad,
though
and
ideal
standard
somewhat
difference,
but
its
product
usability essentially unaffected.
content
﹕
4.1
Inspection according
to
：
Page2~Page9
Quality inspection standards.
4.1.1 Consist of
LOT
：
In a batch number on the card is a LOT
4.1.2
Sample
level
：
If
the
contract
has
a
regulation,
in
accordance
with
the
implementation
of
the
provisions
of
the
contract
sampling; If no rules, using MIL - STD
- 105 e table LEVEL
Ⅱ
,
normal inspection sheet time sampling plan AQL =
0.65
check.
4.1.3
C
riteria
:
Heavy faults acceptable level (AQL)
0.65 (functional) light faults acceptable level
(AQL) 1.00 (appearance )
If there are provisions in
the contract, and in accordance with the
provisions decision.
4.2
If QS - 9000 customers, used the 0
accept 1 back standard.
4.3
The following items are not
stipulated, in accordance with the quality
supervisor sign the sample
determination.
A
cceptable
Quality Levels
Document
number
﹕
DM-QA-001
Make
date
﹕
18-Sep.-2007
Inspection
item
1.P
late edges
①
To
intraplate
infiltration
was
50%
of
the
plate
edge
Gap/Halo
spacing
②
Any local infiltration was
≧
2.54 mm
Board
corner/
Plate edge
damage
Burr
Board blot
Board not neat,
with obvious stain
Water
stain
Foreign
body
(non-
condu
ctor)
Tin
slag
Board tin slag
residual
Board
①
Far
f
rom
the
recent
conductor
spacing
≤
0.2mm
Reading
residual
②
Every board
side
＞
1place
microscope
cooper
③
Every place maximum
size
＞
0.5mm
①
Chafe conductor
②
Far f
rom the
plate 300 mm
visual check appearance
significantly
③
Chafed white
Scratches/
area each surface
＞
5place
，
E
ach white lines each place
Magnifier
maximum size
＞
10mm
，
Appear
fiber bare
Chafed
Magnifier
V
①
Far
f
rom
the
recent
conductor
spacing
＜
0.125mm
②
Every board
side
＞
3place
③
Every place maximum
size
＞
0.8mm
Reading
microscope
V
Board appear a
small amount of water strain
Magnifier
Magnifier
V
V
Cause plate
edge rough broken edge
Magnifier
V
①
Appear
layering
②
Make
base material white
length
≥
5mm
Magnifier
V
Magnifier
V
Inspection
content
Edition
﹕<
/p>
V1.0
Page
number
﹕
2
of
9
Defect name
Decision tool
CR
MA
MI
V
V
Indentati
on
①
Cause between conductor
bridge
②
In
the
middle
of
the
bare
fiber
cause
line
spacing
reduction
＞
20%
③
Medium
thickness
＜
0.09mm
①
Any direction of scallops
Max. size
＞
0.08mm
Magnifier
V
Scallops
Weave
exposure
/
weave
texture
②
Each diameter to 3 mm
circle the number of
together
＞
3
Dew
fabric, glass fiber is not resin completely
covered
Reading
microscope
V
Magnifier
V
-board
For
power
board/
Thick
c
opper-clad
Laminate
（
Copper
thick
≧
2oz
）
：
①
Cause
conductor
spacing
decreases,
and
make
conductor spacing can't meet the
minimum requirements
of
electrical
spacing
②
In
neighboring
between
conductor
of
the
jumper
width
＞
50
％
The
distance
of
adjacent
conductor
③
Thermal
test
have
extended
trend
④
Board side with
microcrack
＞
Plate edge
spacing
50%
，
or
＞
2.54mm
Delamination/Bubble
Hickie
/
microcrack
Magnifier
V
Stratified
foaming
Magnifier
V
Document
number
﹕
DM-QA-001
Make
date
﹕
18-Sep.-2007
Inspection
Inspection content
item
Outside
①
Far
from
the
minimum
range
conductor
≤
0.125mm
inclusion
②
The
particle's maximum
size
＞
0.8mm
4.C
onducting wire
Bolt short
circuit
A broken line/short circuit
①
C
onducting
wire
gap/Hole/Pinhole
Comprehensive
Gap/Hole/
Pinhole
caused
by
the
decrease
of
the
line
width
＞
Design
line width of 20%
②
Defect
length
＞
Wire width of the 10%
，
and
＞
5
mm
Magnifier
V
Magnifier
V
Edition
< br>﹕
V1.0
Page
number
﹕
3
of
9
Decision
tool
Reading
microscope
Defect
name
CR
V
MA
MI
Coating
defect
Conductor
indentati
on
Copper
foil
floating
away from
Coating
defect
in
the
high
voltage,
current
experiment can't
pass
Conductor
indentation
＞
20%
of
Conductor
thickness
Find copper foil
floating away from
Magnifier
V
Magnifier
V
Magnifier
V
Fill
line
forbidden
：
(Receive
Meet the following
condition
)
don't allow fill line
following
requirements
：
and
outer
fill
line
comply
with
the
①
Impedance line
are not allowed to fill line
②
Adjacent parallel wires are
not allowed to
Magnifier
fill line at the same time
③
Conductor corner are not
allowed to fill line
④
Pad
surrounding
cannot
fill
line,
fill
line
point
Fill line
distance
welding
plate
edge
distance
is
greater
than
3
mm
⑤
Pad
surrounding
cannot
fill
line,
fill
line
point
distance
welding
plate
edge
distance
is
greater
than
3
mm
⑥
Bolt length > 2 mm are not
allowed to fill line
Fill
line quantity
：
(Receive
Meet the following
condition
)
②
Every fill line
place
≤
5
place
，
every
side
≤
3 place
③
Fill line board ratio
≤
8%
V
①
The
same
conductor
only
can
fill
line
one
time
Magnifier
V
Fill
line
way
：
(Receive
Meet
the
following
condition
)
①
Fill
line
with
line
default
is
tin
alloy,
and
repair
of
line
width
phase
matching,
other
equivalent
material
subject
to confirmation agree
reliable connection
③
Fill
line
end
migration
acuities
design
line
width
of
10%
④
Fill line for cover
resistance welding line need to Fill
resistance welding
⑤
Intensity
should
not
violate
The
minimum
line
spacing and medium thickness
requirements
V
②
With the end of the wire or
even take 1 mm, to ensure
Magnifier
A
cceptable Quality
Levels
Document
number
﹕
DM-QA-001
Make
date
﹕
18-Sep.-2007
Inspection
item
Reliability of
fill line
：
(Receive
Meet
the
following condition
)
①
To meet the requirements of
the thermal stress test,
at the same
time, thermal stress test trailing line no off
or
damage,
fill
line
resistance
variation
is
not
more
Fill line
than
10%
②
Resistance
to
current
test:
fill
line
end
of
line
plus
2
current,
keep
3
s,
fill
line no closed or damage. Fill line
method,
should be able to through the
IPC - TM - 650 2
5 4 and IPC - TM - 650
2 5 4 1 a evaluation
③
Adhesion
test:
reference
IPC
-
TM
-
650
2.5.4
tape test, fill line
without shedding
Magnifier
V
CR
MA
MI
Inspection
content
Edition
﹕<
/p>
V1.0
Page
number
﹕
4
of
9
Decision tool
Defect name
Conducting
wire
rough
Conducting
wire width
Conducting
wire gap
Impedance
①
Conductor
rough
＞
Design line width of
20%
②
Influence conducting
wire length
＞
13mm
③
Influence
conducting
wire
length
＞
line
length 10%
The
actual
line
width
deviation
finished
product design line width
over
±
20%
Line gap
reduction
＞
Design gap of 20%
The characteristic impedance change
more than
design value of finished
product
±
10%
Reading
microscope
Reading
microscope
Reading
microscope
Magnifier
Reading
microscope
V
V
V
Reading
microscope
V
finger
Glossiness
on
finger
①
Obvious
scuffing
in
key
area
②
Other
areas
Gold finger
of
the
scuffing
has
the
dew
nickel
and
dew
scuffing
copper
③
Every
side
has
gold
finger
scuffing
＞
2 place
Copper foil
Copper foil
floating away from gold finger
floating
away from
finger
A
、
B
area
：①
Surface
coating
not
Surface
on
gold
finger
complete,
has
the
dew
nickel,
dew
copper,
splash
tin
②
A
salient
point,
foaming,
stain
area
diameter
≥
0.2mm
，
Non-critical
area
its
diameter
＞
0.3mm
，
Non-critical
area
its
diameter
＞
2
place(defect)
Gold finger
boundary dew copper area
length
＞
0.13mm
boundary
dew copper
Edge
contact
burr
plating
adhesion
①
Plate edge not neat
②
Edge rough appear
copper foil peel base material, burr
inward
Magnifier
penetration
> 50% of the plate edge ullage
metal
falls off phenomenon
Magnifier
V
V
Reading
microscope
V
Reading
microscope
V
Magnifier
V
Magnifier
V
Gold finger oxidation,
black
V
V
Solder mask
Green oil on A
and B area; Green oil on gold
gold
finger length > C area length of 50%
Gold finger
Use
3
M
tape do
adhesion experiment, a coating
A
cceptable Quality
Levels
Document
number
﹕
DM-QA-001
Make
date
﹕
18-Sep.-2007
Inspection
item
The
hole
and
design
are
discrepancy
Plugging
plugin
hole
Lead
Solder
ball
tin
plug
hole
plugging
via
Aperture
acuities
were
0.35
mm
via
lead
tin
into
the hole, and in the
reflow soldering or simulation
of
reflow soldering lead tin show orifice or flow to
the panel
Appear
foreign body plug hole phenomenon
PTH
hole
conduction
performance
is
good,
hole
resistance acuities
≦
1 m
?
oxidation phenomenon
PCB a
fter a wave soldering
popping phenomenon;
Popping
Or
popping
phenomenon,
but
the
section
Magnifier
V
confirmed with a hole in the wall
quality problem
①
The wall of holes breakage
more than one, and
broken
hole
number
more
than
5%
of
the
total
PTH
wall
of
hole
number
of
holes
②
Transverse
>
90
°
(3)
is breakage
longitudinal > 5% of the plate
thickness
①
NPTH
or PTH
，
discrepancy with
design file
②
less holes , more holes
Magnifier
V
CR
MA
MI
Inspection content
Edition
﹕
V1.0
Page
number
﹕
5
of
9
Decision tool
Defect name
Do
not meet the requirements of customer aperture
plug guage
tolerance
V
A hole residual solder ball diameter >
0.1 mm, tin
beads via quantity > plug
hole 1% of the total
Magnifier
V
Plug via
Magnifier
V
Foreign body plug
hole
PTH
conduction
Magnifier
Magnifier
Magnifier
V
V
V
PTH
wall
of
hole
PTH
w
all
of
hole
is
not
smooth
bright,
dirt
and
is bad
Magnifier
V
-
-
-
-
-
-
-
-
-
上一篇：《综合教程1》教案Unit 1 (1)
下一篇：考研英语阅读中英全文对照版 (4)