-
微組裝技術﹕
MPT/Microelectronic
Packaging
echnology
混裝技術﹕
Mixed
Component
Mounting
Technology
封裝﹕
Package
貼片﹕
Pick
and
Place
拆焊﹕
Desoldering
再流﹕
Reflow
浸焊﹕
Dip
Soldering
拖焊﹕
Drag
soldering
印制電路﹕
Printed
Circuit
印制線路﹕
Printed
Wiring
印制電路板﹕
printed
circuit
board
印制線路板﹕
printed
wiring
board
層壓板﹕
laminate
覆铜銅薄层壓板﹕
copper-clad
laminate
基材﹕
base
material
成品板﹕
production
board
印刷﹕
printing
導電圖形﹕
conductive
pattern
印制元件﹕
printed
component
單面印制板﹕
single-sided
printed
board
雙面印制板﹕
double-sided
printed
board
多層印制板﹕
multilayer
printed
board
電烙鐵﹕
Iron
熱風嘴﹕
hot
air
reflowing
noozle
吸錫帶﹕
soldering
wick
吸錫器﹕
tin
extractor
焊後檢驗﹕
post-
soldering
inspection
目視檢驗﹕
visual
inspection
機器檢驗﹕
machine
inspection
焊點質量﹕
soldering
joint
quality
焊電缺陷﹕
soldering
jont
defect
錯焊﹕
solder
wrong
漏焊﹕
solder
skips
虛焊﹕
pseudo
soldering
冷焊﹕
cold
soldering
橋焊﹕
solder
bridge
脫焊﹕
open
soldering
焊點剝離﹕
solder
off
不潤濕焊點﹕
soldering
nonwetting
錫珠﹕
solder
ball
拉尖﹕
icicle
；
solder
projection
孔洞﹕
void
焊料爬越﹕
solder
wicking
過熱焊點﹕
overheated
solder
connection
不飽和焊點﹕
insufficient
solder
connection
過量焊點﹕
excess
solder
connection
助焊劑剩余﹕
flux
residue
焊料裂紋﹕
solder
crazeing
焊角翹起﹕
fillet-
lifting
；
lift-off
AI
:Auto-Insertion
自動插件
AQL
:acceptable
quality
level
允收水準
ATE
:automatic
test
equipment
自動測試
ATM
:atmosphere
氣壓
BGA
:ball
grid
array
球形矩陣
CCD
:charge
coupled
device
監視
連接元件
(
攝影機
)
CLCC
:Ceramic
leadless
chip
carrier
陶瓷引腳載具
COB
:chip-on-
board
晶片直接貼附在電路板上
cps
:centipoises
(
黏度單位
)
百分之一
CSB
:chip
scale
ball
grid
array
晶片尺寸
BGA
（
< br>BGA
是一个封装形式
,
它的引
脚是
球栅阵列
,
它的引脚排列是
A1.A2.X
用
ABCD......Y<
/p>
用
12345.....
表示
,
其交叉点就如
A1....
）
CSP
:chip
scale
package
晶片尺寸構裝
CTE
:coefficient
of
thermal
expansion
熱膨脹系數
DIP
:dual
in-line
package
雙
內線包裝
(
泛指手插元件
)
FPT
:fine
pitch
technology
微間距技術
FR-4
:flame-retardant
substrate
玻璃纖維膠片
(
用來製作
PCB
材質
< br>)
IC
:integrate
circuit
積體電路
IR
:infra-red
紅外線
Kpa
:kilopascals(
壓力單位
)
LCC
:leadless
chip
carrier
引腳式晶片承載器
MCM
:multi-chip
module
多層晶片模組
MELF
:metal
electrode
face
二極體
MQFP
:metalized
QFP
金屬四方扁平封裝
NEPCON
:National
Electronic
Package
and
Production
Conference
國際電子包裝及生產會議
ppm:parts
per
million
指每百萬
PAD(<
/p>
點
)
有多少個不良
PAD(
點
)
psi
:pounds/inch2
磅
/
英吋
2
PWB
:printed
wiring
board
電路板
QFP
:quad
flat
package
四邊平坦封裝
SIP
:single
in-line
package
SIR
:surface
insulation
resistance
絕緣阻抗
SMC
:Surface
Mount
Component
表面黏著元件
SMD
:Surface
Mount
Device
表面黏著元件