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SMD
常用术语
微组装技术﹕
MPT/Microelectronic
Packaging echnology
混装技术﹕
Mixed Component
Mounting Technology
封装﹕
Package
贴片﹕
Pick and Place
拆焊﹕
Desoldering
再流﹕
Reflow
浸焊﹕
Dip Soldering
拖焊﹕
Drag soldering
印制电路﹕
Printed Circuit
印制线路﹕
Printed Wiring
印制电路板﹕
printed circuit board
印制线路板﹕
printed wiring board
层压板﹕
laminate
覆铜薄层压板﹕
copper-clad laminate
基材﹕
base material
成品板﹕
production board
印刷﹕
printing
导电图形﹕
conductive pattern
印制组件﹕
printed component
单面印制板﹕
single-sided printed
board
双面印制板﹕
double-sided
printed board
多层印制板﹕
multilayer printed
board
电烙铁﹕
Iron
热风嘴﹕
hot air reflowing
noozle
吸锡带﹕
soldering wick
吸锡器﹕
tin extractor
焊后检验﹕
post-soldering
inspection
目视检验﹕
visual
inspection
机器检验﹕
machine
inspection
焊点质量﹕
soldering
joint quality
焊电缺陷﹕
soldering jont defect
错焊﹕
solder wrong
漏焊﹕
solder
skips
虚焊﹕
pseudo soldering
冷焊﹕
cold soldering
桥焊﹕
solder bridge
脱焊﹕
open soldering
焊点剥离﹕
solder off
不润湿焊点﹕
soldering nonwetting
锡珠﹕
solder ball
拉尖﹕
icicle
；
solder projection
孔洞﹕
void
焊料爬越﹕
solder wicking
过热焊点﹕
overheated solder
connection
不饱和焊点﹕
insufficient solder connection
过量焊点﹕
excess solder
connection
微组装技术﹕
MPT/Microelectronic
Packaging echnology
混装技术﹕
Mixed Component
Mounting Technology
封装﹕
Package
贴片﹕
Pick and Place
拆焊﹕
Desoldering
再流﹕
Reflow
浸焊﹕
Dip Soldering
拖焊﹕
Drag soldering
印制电路﹕
Printed Circuit
印制线路﹕
Printed Wiring
印制电路板﹕
printed circuit board
印制线路板﹕
printed wiring board
层压板﹕
laminate
覆铜薄层压板﹕
copper-clad laminate
基材﹕
base material
成品板﹕
production board
印刷﹕
printing
导电图形﹕
conductive pattern
印制组件﹕
printed component
单面印制板﹕
single-sided printed
board
双面印制板﹕
double-sided
printed board
多层印制板﹕
multilayer printed
board
电烙铁﹕
Iron
热风嘴﹕
hot air reflowing
noozle
吸锡带﹕
soldering wick
吸锡器﹕
tin extractor
焊后检验﹕
post-soldering
inspection
目视检验﹕
visual
inspection
机器检验﹕
machine
inspection
焊点质量﹕
soldering
joint quality
焊电缺陷﹕
soldering jont defect
错焊﹕
solder wrong
漏焊﹕
solder
skips
虚焊﹕
pseudo soldering
冷焊﹕
cold soldering
桥焊﹕
solder bridge
脱焊﹕
open soldering
焊点剥离﹕
solder off
不润湿焊点﹕
soldering nonwetting
锡珠﹕
solder ball
拉尖﹕
icicle
；
solder projection
孔洞﹕
void
焊料爬越﹕
solder wicking
过热焊点﹕
overheated solder
connection
不饱和焊点﹕
insufficient solder connection
过量焊点﹕
excess solder
connection
助焊剂剩余﹕
flux
residue
焊料裂纹﹕
solder
crazeing
焊角翘起﹕
fillet-
lifting
；
lift-off
AI :Auto-Insertion
自动插件
AQL
:acceptable quality level
允收水平
ATE
:automatic test equipment
自动测试
ATM
:atmosphere
气压
BGA :ball grid array
球形矩阵
CCD :charge
coupled device
监视连接组件
(
摄影机
)
CLCC :Ceramic
leadless chip carrier
陶瓷引脚载具
COB :chip-on-board
芯片直接贴附在电路板上
cps
:centipoises(
黏度单位
)
百分之一
CSB :chip
scale ball grid array
芯片尺寸
BGA
CSP :chip
scale package
芯片尺寸构装
CTE :coefficient of thermal expansion
热膨胀系数
DIP :dual
in-line package
双内线包装
(
泛指手插组件
)
FPT :fine pitch
technology
微间距技术
FR-4 :flame-retardant substrate
玻璃纤维胶片
(
用来制作
PC
B
材质
)
IC
:integrate circuit
集成电路
IR :infra-red
红外线
Kpa
:kilopascals(
压力单位
)
LCC :leadless chip carrier
引脚式芯片承载器
MCM
:multi-chip module
多层芯片模块
MELF :metal electrode face
二极管
MQFP
:metalized QFP
金属四方扁平封装
NEPCON :National Electronic Package and
Production Conference
国际电子包装及生产会议
ppm:parts per million
指每百万
PAD(
点
)
有多
少个不良
PAD(
点
)
psi :pounds/inch2
磅
/
英吋
2
PWB :printed wiring board
电路板
QFP :quad
flat package
四边平坦封装
SIP :single in-line package
SIR :surface insulation resistance
绝缘阻抗
SMC :Surface
Mount Component
表面黏着组件
SMD :Surface Mount Device
表面黏着组件
SMEMA
:Surface Mount Equipment
Manufacturers
Association
表面黏着设备制造协会
SMT :surface mount technology
表面黏着技术