wafer_术语

硅片行业术语大全

(

中英文对照

I-Z)

Ingot - A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are

cut.

晶锭

-

由多晶或单晶形成的圆柱体，晶圆片由此切割而成。

Laser Light-Scattering Event - A signal pulse that locates surface imperfections on a wafer.

激光散射

-

由晶圆片表面缺陷引起的脉冲信号。

Lay - The main direction of surface texture on a wafer.

层

-

晶圆片表面结构的主要方向。

Light Point Defect (LPD) (Not preferred; see localized light-scatterer)

光点缺陷

(LPD)

（不推荐使用，参见

“

局部光散射

< br>”

）

Lithography - The process used to transfer patterns onto wafers.

光刻

-

从掩膜到圆片转移的过程。

Localized Light-Scatterer - One feature on the surface of a wafer, such as a pit or a scratch that

scatters light. It is also called a light point defect.

局部光散射

-

晶圆片表面特征，例如小坑或擦伤导致光线散射，也称为光点缺陷。

Lot - Wafers of similar sizes and characteristics placed together in a shipment.

批次

-

具有相似尺寸和特性的晶圆片一并放置在一个载片器内。

Majority Carrier - A carrier, either a hole or an electron that is dominant in a specific region, such

as electrons in an N-Type area.

多数载流子

-

一种载流子，在半导体材料中起支配作用的空穴或电子，例如在

N

< br>型中是电

子。

Mechanical Test Wafer - A silicon wafer used for testing purposes.

机械测试晶圆片

-

用于测试的晶圆片。

Microroughness - Surface roughness with spacing between the impurities with a measurement of

less than 100 μm.

微粗糙

-

小于

100

微米的表面粗糙部分。

Miller Indices, of a Crystallographic Plane - A system that utilizes three numbers to identify plan

orientation in a crystal.

Miller

索指数

-

三个整数，用于确定某个并行面。这些整数是来自相同系统 的基本向量。

Minimal Conditions or Dimensions - The allowable conditions for determining whether or not a

wafer is considered acceptable.

最小条件或方向

-

确定晶圆片是否合格的允许条件。

Minority Carrier - A carrier, either a hole or an electron that is not dominant in a specific region,

such as electrons in a P-Type area.

少数载流子

-

在半导体材料中不起支配作用的移动电荷，在

P

型中是电子，在

N

型中是 空

穴。

Mound - A raised defect on the surface of a wafer measuring more than 0.25 mm.

堆垛

-

晶圆片表面超过

0.25

毫米的缺陷。

Notch - An indent on the edge of a wafer used for orientation purposes.

凹槽

-

晶圆片边缘上用于晶向定位的小凹槽。

Orange Peel - A roughened surface that is visible to the unaided eye.

桔皮

-

可以用肉眼看到的粗糙表面

Orthogonal Misorientation -

直角定向误差

-

Particle - A small piece of material found on a wafer that is not connected with it.

颗粒

-

晶圆片上的细小物质。

Particle Counting - Wafers that are used to test tools for particle contamination.

颗粒计算

-

用来测试晶圆片颗粒污染的测试工具。

Particulate Contamination - Particles found on the surface of a wafer. They appear as bright points

when a collineated light is shined on the wafer.

颗粒污染

-

晶圆片表面的颗粒。

Pit - A non-removable imperfection found on the surface of a wafer.

深坑

-

一种晶圆片表面无法消除的缺陷。

Point Defect - A crystal defect that is an impurity, such as a lattice vacancy or an interstitial atom.

点缺陷

-

不纯净的晶缺陷，例如格子空缺或原子空隙。

Preferential Etch -

优先蚀刻

-

Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in

the

photolithography

process,

and

metal

contamination

monitoring.

This

wafer

has

very

strict

specifications for a specific usage, but looser specifications than the prime wafer.

测试晶圆片

-

影印过程中用于颗粒计算、测量溶解度和检测金属污染的晶 圆片。对于具体

应用该晶圆片有严格的要求，但是要比主晶圆片要求宽松些。