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电子行业英名词解释

作者:高考题库网
来源:https://www.bjmy2z.cn/gaokao
2021-02-26 05:16
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2021年2月26日发(作者:过去式的英文)







1.



使













词< /p>









2.




于< /p>









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1



SOP










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2-1.



SOP










2-1-1.











序< /p>













1.



D


C/DC Charger



2.



G


auge


3.



H


ybrid



4.



I


nverter



5.



L


AN


6.



M


odem





















IC

















2-1-2.











序< /p>




















1.




面< /p>







1.



SMT (Surface Mount Technology)


2.



ICT (In Circuit Tester)



3.



Visual Inspection



4.



T/U (Touch up)



5.



Snap



6.



Hi-pot Test


7.



Programming



8.



Programming Check



9.



B/I (Burn In)



10.



A


TE test (Automatic Test Equipment)








< p>


















































11.



Inspection


12.



Pack


13.



FQA (Final Quality Assurance)



14.



R/W (Rework)



15.



Repair (T/S; Trouble Shooting)




2-1-3.



使







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字< /p>







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1.



Constant Temperature Soldering Iron





























































/


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线



< br>器























2.



Conveyor



3.



ESD Wrist strap



4.



Fixture


5.



Furnace


6.



High Speed Machine



7.



Laser Scribe


8.



Microscope



9.



Oven


10.



Partition


11.



Paste Roller



12.



Printer


13.



Probe


14.



Probe Card



15.



Reflow


16.



Scanner


17.



Screen Cleaner



18.



Temperature Profile



19.



Tension Gauge



20.



Thick Measurement



21.



Tray


22.



Universal Machine



23.



Viscosity Meter




2-1-4.











排< /p>












1.



Barcode


2.



Bracket


3.



Bracket


4.



Capacitor



5.



Capillary


6.



Carton


7.



Ceramic Substrate



8.



Coil























线
















9.



Conductive Sponge



10.



Conductor Paste



11.



Connector



12.



Crystal (XT


AL)



13.



Dielectric Paste



14.



Diode


15.



Epoxy


16.



EPROM (Erasable and Programmable


Read Only Memory)


17.



Fuse


18.



Golden Finger



19.



Header


20.



Heat Sink


21.



IC (Integrated Circuit)



22.



Inductor



23.



Insulator



24.



Jack


25.



Mylar


26.



Overglass Paste



27.



PROM (Programmable Read Only


Memory)


28.



Resistor



29.



Resistor Array


30.



Resistor Paste



31.



Silicone


32.



SIMM Socket


33.



Socket


34.



Solder Paste



35.



Switch


36.



Thermal


37.



Transformer



38.



Transistor



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2-1-5.










顺< /p>














1.



Bottom side of PCB



2.



Cold Solder



3.



Component Damage



4.



Empty Solder



5.



Float


6.



Oxidation


7.



P/N (Part Number)



8.



Polarity


9.



Shift


10.



Short


11.



Solder Ball


12.



Solder Icicle



13.



Solder Residue



14.



Substrate


15.



Top side of PCB






























































2-2.







与< /p>









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1.



AQL


2.



BOM


3.



Cassette



4.



Cold Solder



5.



CQCN


6.



CRP



7.



D/W


8.



ECN/ECR


9.



Empty Solder



10.



ENG P


roduction










Acceptable Quality Level


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Bill Of Material







表< /p>









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力< /p>







Customer Quality Co


mplain Notice


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Capacity Requiremen


t Plan







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Die mount / Wire bonding





/



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Engineering


Change


Request/


Notice


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接< /p>









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11.



ESD


12.



Golden Sample



13.



Hold Notice



14.



Identification


15.



Lead Frame



16.



Lo


ader/


Unloader



Electric Static Discharge

























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使










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17.



Marking


18.



MO







Manufacture Order






Material Revie


w Board


,制








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19.



MRB














< br>料















20.



MRP



21.



MSC


22.



OJT


23.



P/R


24.



Pawl


25.



PCB


26.



Pin Pinch


27.



PM


28.



R/W


29.



Repair



Material Require


ment Plan







计< /p>




Method Standard Change




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On Job Training








Pilot Run







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Printed Circuit Board





线


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work








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使
















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Sample Design Change Notice


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30.



SDCN
























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31.



SIP


32.



SIP


33.



Snap


34.



Solder Ball



35.



Solder Icicle



36.



Solder Residue



37.



SOP



38.



SPC


Single


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Standard Inspection Procedure






















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39.



Tray


40.



Week code



41.



WIP


42.







43.







44.








45.


















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Work In Process






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使


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料< /p>









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48.




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52.








53.







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Sample


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Manufacture


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Test


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57.








58.




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59.






60.






61.






















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Stencil


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--

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1. SOP









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est



Automatic Test Equipment



自动测试



B/I



Burn In






Barcode



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Bottom side of PCB




< br>背




Bracket






Capacitor






Capillary




线



< br>Carton




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Ceramic Substrate






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Coil







Cold So lder






Component Damage





Conductive S ponge







Conductor Pa ste








Connector

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Constant Temperature Soldering Iron



恒温烙铁



Conveyor







Crystal



XTAL






DC/DC Charge r





器< /p>



Dielectric Paste










Diode







Empty Solder


< p>




Epoxy





< p>




EPROM



Erasable


and


Programmable


Read Only Memory







写< /p>









< p>





ESD Wrist strap







Fix ture






Float



< br>件



FQA



Final Quality Assurance




< p>





Furnace







Fuse







Gauge









Golden Finger







Heade r





头< /p>



Heat Sink







High Speed Machine






Hi-pot Test








Hybrid





IC


IC (Integrated Circuit)

< p>







ICT



In Circuit Te ster











Inductor






Inspection






Insulator



< br>缘




Inverter





< p>


Jack






LAN







Laser Scribe







< p>


Microscope







M odem









M ylar







Oven





Overglass Pa ste









< /p>


Oxidation






P/N



Part Number








Pack






Partit ion






Paste Roller







< p>


Polarity






Printer

< br>:







/








Probe Card



< p>






Probe



< p>





Programming Check






Programming






PROM



Programmable


Read


Only


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