日本东京精密

东京精密株式会社

公司简介

东京精密株式会社是日本著 名半导体制造设备之一

,

公司总部设在日本东京都三

,

在美国

,

欧洲

,

新加坡

,

中国等地设有分公司

,

研发基地或生产厂等

.

We develop our businesses in two key areas: semiconductor

manufacturing equipment and precision measuring systems.

Our philosophy is

to generate long-term growth through the creation of

beneficial, relationships, with all our stakeholders - customers, business

partners, shareholders and employees.

（公司网站原文）

东京精密主要从事半导体加工设备及精密测量仪器制造及开发

.

半导体加工设

备有硅片加工用地倒角机、内圆切片机

半导体加工前道工序用的光刻机

（

）、

CMP

、 晶片表面综合检查设备及测试封装用的探针台、划片机、

硅片背面抛光机等

.

过去，东京精密简 称“

TSK

”，在国内半导体行业享有盛誉。现在东京精密

采用了新的商标“

ACCRETECH

”， 她是由英文成长

ACCRETE

和技术

TECHNOLOGY

的合成词，是融合公司”以

WIN-WI N

精神工作，创世界一流产

品“经营理念的新标志。

参展产品：

硅片材料的内圆切片机、硅片倒角机，光刻机，

CMP

，硅片表

面检查系统，探针台背面减薄抛光机，划片机。

网址：

/

Semiconductor Manufacturing Equipment:Product list

Wafer Manufacturing System

Variety of products line for wafer manufacturers including Wafer Slicing

Machine and Wafer Edge Grinding Machine.

Sliced Wafer Carbon Demounting and Cleaning Machine : C-RW-200/300

Feature 1

Automatic demounting of wafers from the slicing base, cleaning and storing

into the cassette.

Wafer Edge Grinding: W-GM-5200

?

Newly-developed grinding unit enhances the rotative precision of the

spindle, and improves the surface roughness.

?

?

The non-contact measuring method achieves the stable alignment.

Performs the non-contact measuring of the pre-processed wafer

thickness at multiple points, the diameter and notch depth of the

post- processed wafer.

?

?

The modular concept to make the optimum process line possible.

Low damage grinding method is available.

Feature 1

Machine specification ready for 300 mm and 200 mm wafer.

Feature 2

Visual system (optional) for measuring the chamfer width of periphery and

notch.

Wafer Edge Grinding: W-GM-4200

?

Newly-developed grinding unit enhances the rotative precision of the

spindle, and improves the surface roughness.

?

?

The non-contact measuring method achieves the stable alignment.

Performs the non-contact measuring of the pre-processed wafer

thickness at multiple points, the diameter and notch depth of the

post- processed wafer.

?

?

The modular concept to make the optimum process line possible.

Low damage grinding method is available.

Feature 1

Machine specification ready for 75 - 150 mm wafer or for 150 - 200 mm wafer.

Feature 2

Capable of various material processes, such as chemical compound

semiconductor.

Wafer Slicing Machine: S-LM-116G

Precise slicing machine for fragile materials such as glass, ceramics, ferrite.

Feature 1

16

Feature 2

Open-structure loading unit for easy mounting of the workpiece.

Feature 3

Easy setting of slicing speed and wafer thickness with digital switch.

Feature 4

Strong frame, highly rigid table provides long-term stability in performance.

Feature 5

Easy coolant adjustment and dressing operation.

Wafer Slicing Machine: A-WS-100S

Scribes wafer substrate with high precision

Feature 1

Easy alignment

With fine adjustment in horizontal and rotative directions

Feature 2

Easy scribe setting

With the touch panel to set the index amount, number of times of scribing, etc.

CMP

CMPs remove unevenness on wafer surfaces that occur during the production

process. Applications are growing due to the increase of layers in

semiconductor devices and the growing variety of wiring materials.

ChaMP: For 300mm Wafers

Combining the technological expertise built up by Accretech in precision

measuring equipment and semiconductor manufacturing equipment, we now

offer

with process performance required by design rules for 90 nm and 32 nm

devices, and able to keep up with the most advanced volume-production fabs.

Feature 1Air-float Head

?

Reference polishing is made possible via an air cushion that provides

uniform pressure distribution.

?

Wafer pressure is applied by an airbag independent of ring pressure,

providing excellent low-pressure controllability and stability.

?

Zone control is available.

Feature 2Edge Exclusion of 1 mm!

Feature 3Wafer Pressure Controllability & Repeatability

Feature 4Simple Maintenance for Polishing Heads - Ring Change

Demounting (approximately 5 seconds)

Slide the snap ring cover up with both hands

Spread the snap ring with your thumb (the retaining ring drops off)

Completely remove the retaining ring

Mounting (approximately 10 seconds)

1.

Grip the snap ring with both hands and push the retainer into the

carrier. Rotate it slightly to align the faces where the positioning

frame slips into place.

2.

Attach the snap ring round the whole circumference and slide the

cover down.

ChaMP: For 150 or 200mm Wafers

For 150 or 200mm Wafers

ChaMP: Compact CMP System

Small footprint

Wafer Probing Machines

Wafer probing machines perform electrical tests of each chip on a wafer,

ensuring the quality of semiconductor devices.

Wafer Probing Machines: UF3000EX

Next-generation high-spec probing machine the world No.1 supplier presents

Phenomenal levels of throughput have been made possible with the

synergistic effects of high-speed wafer handling enabled by a new algorithm,

and the high-speed and low-noise XY Stage enabled by a newly developed

purpose-built drive unit for probes. The Z axis ensures world-class load

capacity and high precision, and offers excellent contact via an optimal

structural design that employs topology which reliably eliminates changes in

flatness due to positioning.

With advanced OTS latest positioning system technology and by colorizing

wafer alignment imaging and equipping a light super magnification function,

the UF3000EX has improved dramatically in terms of precision and operability.

Wafer Probing Machines: UF3000EX-e

Assimilating the up-to-date technologies such as originative OTS, QPU and

TTG, this super high-spec system provides the testing system which meets

your needs for the miniaturization of the next-generation devices and various

testing environment.

Feature 1

OTS - the newest positioning technology (Optical Target Scope)

OTS enables to measure the relative position of the cameras with absolute

accuracy, which improved dramatically.

Based on the ACCRETECH metrology technology, OTS enables the

self-correlation of the alignment optical system.

Feature 2

QPU - super high-rigid chucking (Quad-Pod Unit)

To effectively attain the accuracy in positioning, the high rigidity of every part is

greatly important.

The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for

Z-axis, enabling the high-rigid, stable probe contact.

Feature 3

Load-port

Testing environment satisfying the users' needs is available by the common

platform of 8-inch and 12-inch cassettes and the front allocation of the

inspection tray. The machine is also ready for AMHS (Automated Material

Handling System).

Feature 4

TTG (Touch To Go)

Pursuing the easy operation, the UF3000 adopts the function to move to the

position you touch on the map or image shown on the touch panel. Setting up

is easy, and screen configuration is possible by the user definition.

Wafer Probing Machine: UF2000

Tokyo Seimitsu, now known as Accretech, has continued to lead the

semiconductor industry as the world's number one manufacturer of wafer

probing machines. The newly developed UF2000 high-precision 200mm wafer

prober is designed for devices with decreasing pad pitches typified by LCD

drivers and other such devices, and features enhanced functionality in all

areas, while offering the same functions and operating ease as the previous

model.

Feature 1

Achieves overall precision of ±

1.5?

m.

Feature 2

Adopts new processor, newly designed loader and image processing system

with enhanced performance, dramatically boosting throughput.

Wafer Probing Machine: UF200R

Evolving and Proliferating Wafer Probing Machine, UF Series

Based on a flexible platform, the high accuracy and high rigidity, UF series is

further evolved. Wafers are varying with the progress of line width shrinkage

and assembly technology. This machine can be used for processing very thin

wafers and can be used as a handler for the wafer level burn-in system.

Feature 1

8-inch multipurpose machine.

Wafer Probing Machine: UF190R

Evolving and Proliferating Wafer Probing Machine, UF Series

Based on a flexible platform, the high accuracy and high rigidity, UF series is

further evolved. Wafers are varying with the progress of line width shrinkage

and assembly technology. This machine can be used for processing very thin

wafers and can be used as a handler for the wafer level burn-in system.

Feature 1

High- performance, high-throughput, and excellent cost performance machine.