-
芯片封装方式大全
各种
IC
封装形式图片
QFP
Quad
Flat
BGA
Package
Ball Grid
Array
TQFP
EBGA 680L
LBGA
160L
PBGA 217L
Plastic Ball
Grid
Array
SDIP
SC-70 5L
SBGA
100L
SBGA 192L
SIP
Single Inline
Package
SO
TSBGA 680L
Small
Outline
Package
CLCC
SOJ
32L
CNR
Communicatio
n and
Networking
Riser
SOP EIAJ
Specification
TYPE II 14L
Revision
1.2
SOJ
CPGA
Ceramic Pin
Grid Array
SOT220
SSOP 16L
DIP
Dual Inline
Package
DIP-tab
Dual Inline
Package with
SSOP
Metal
Heatsink
FBGA
TO18
FDIP
TO220
FTO220
TO247
Flat Pack
TO264
HSOP28
TO3
ITO220
TO5
TO52
ITO3p
TO71
JLCC
LCC
TO72
LDCC
TO78
LGA
TO8
LQFP
TO92
PCDIP
TO93
PGA
Plastic Pin Grid
Array
TO99
TSOP
Thin Small
PLCC
Outline
Package
详细规格
TSSOP or
TSOP II
PQFP
Thin
Shrink
PSDIP
LQFP 100L
Outline
Package
uBGA
Micro Ball
Grid Array
详细规格
uBGA
METAL QUAD
Micro Ball
100L
Grid Array
详细规格
PQFP 100L
详细规格
QFP
Quad Flat
Package
ZIP
Zig-Zag
Inline
Package
SOT220
TEPBGA 288L
TEPBGA
C-Bend
Lead
SOT223
CERQUAD
Ceramic
Quad Flat
SOT223
Pack
详细规格
Ceramic
Case
SOT23
LAMINATE
CSP 112L
SOT23/SOT32
3
详细规格
Chip Scale
Package
SOT25/SOT35
3
Gull Wing
Leads
SOT26/SOT36
3
LLP 8La
详细规格
SOT343
PCI 32bit
5V
Peripheral
Component
Interconnec
t
详细规格
SOT89
PCI 64bit
3.3V
SOT89
PCMCIA
SOT523
Socket 603
Foster
PDIP
LAMINATE
TCSP 20L
Chip Scale
Package
PLCC
详细规格
SIMM30
Single
TO252
In-line
Memory
Module
SIMM72
TO263/TO268
Single
SO DIMM
Small Outline
Dual In-line
Memory
Module
In-line
SOCKET 370
SLOT 1
For intel 370
For intel
pin PGA
Pentium II
Pentium III &
Celeron CPU
&
Celeron
CPU
Pentium III
SIMM72
Single
In-line
Memory
Module
SLOT A
For AMD
Athlon CPU
SOCKET
423
For intel 423
pin PGA
Pentium 4 CPU
SOCKET
SNAPTK
462/SOCKET
A
For PGA AMD
Athlon &
Duron CPU
SNAPZP
SNAPTK
SOCKET 7
For intel
SOH
Pentium &
MMX Pentium
CPU
各种封
装
缩
写
说
明
BGA
BQFP132
BGA
BGA
BGA
BGA
BGA
CLCC
CNR
PGA
DIP
DIP-tab
BGA
DIP
TO
Flat Pack
HSOP28
TO
TO
JLCC
LCC
CLCC
BGA
LQFP
DIP
PGA
PLCC
PQFP
DIP
-
-
-
-
-
-
-
-
-
上一篇:中国日报英语词汇精华
下一篇:软件概要设计说明书