英语论文翻译分析

0 .5

毫米的螺距组件来说，实现打印率不到

60%

并不少见【

12

】

。孔径大 小

和钢网厚度需要适当调整确保了高转移率（黏贴沉积和孔径卷）

【

13

】

。一

般来说，

光圈相对于附件垫应该是超大号的来增加焊料沉积体积和转移率。

球 的形成趋势

【

14

】

< br>。

图片

3

显示栽培要影响焊点质 量的输出的所有可能的

数量。

4

新的组件放置

用于在印刷板上放置组 建的策略可以分为进入管道，质量，顺序，同时放

置【

16

】

。

在高容量生产中，专用的顺序或质量可 能会执行位置。

在大多数

情况下，柔性对于适应新产品和组件式 非常重要的。通常

SMT

组装使用

顺序 元件布局。两个类型的放置设备用于顺序挑拣和放置操作；第一个是

一个

X-Y

龙门式第二个是定头移动表放置机器【

12

】

。头顶的设备提供高

灵活性，中放置的速 度，精度高，最小加速度或运动的

PCB

。相比之下，

表运动及其（通常旋转炮塔头）提供高位置速度和中等精度额灵活性，但

征收高加速度的

PCB

【

17

】

。

另一个重要特性 放置系统映像的是视觉系统的需要【

17,18

】

。一个主

要问题是设备的能力来识别功能在黑板上和组件和正确地放置在设备 的校

准设备导致附件垫在

PCB

。照明 的包从低角度，即侧照明，可以需要防止

错误的位置和

SMT< /p>

【

19

】

。

4

联合水平附件

传热机制用于大规模回 流焊接过程包括对流，辐射（使用辐射来源）和冷

凝（气相）

【

20

】

。回流焊的最流行方法是基于强 制对流或红外辐射。一些

其他的方法的焊料是气相，激光和热棒。处理大规模的回流焊接 ，

PCBA

主要往往受到一个波峰焊接操作。在波焊的应用程序 中，经过的

PCBA

一

波喊的焊料是吸 引所有科室的表面，包括组建领导。波温必须仔细控制预

防从燃烧的焊点。

在任何回流系统，

均匀的温度在

PCB

和在一个组件是一

个主要目标【

2,21

。对于一个

SMT

系统 ，一个温度梯度是

10

摄氏度或更

少应 该保持的防止变形包和确保所有关节正常回流。

5

组建的开发工具

发达的系统由两个主 要组件组成。这个组件式面向对象的性质，分别代表

一个特定的功能组件的整体。这种形 式的编程时声明性的，代表事实和主

张而不是程序。

·主要的组件包括测试软件，这将决定是否将输入的值不产生一个可靠地

焊接接头。这是通过使用可扩展标记语言（

XML

）来完成的。 晚间定义了

参数进行测试，起约束和依赖以及一个程序模块解释测试。这是一个简单

地，非常灵活的文本格式最初是为了满足大规模电子出版的挑战。

X ML

在

Web

和别处各种的数据交流也 发挥着越来越重要的作用【

22

】。

6

未来研究方向

< br>这种直观的系统将积极消除的主要问题导致表面组装

PCB

操作。

谈话种类

与快乐度关系和数目的减少缺陷也将被制作成 表格的工具的理由。统计分

析焊点的质量输出在这项研究中没有被提出。在不久的将来， 完成测试的

结果和统计研究不同的组件和流程变量。

参考文献

Internet- based electronics manufacturing

troubleshooting tool

for surface mount PCB assembly

Received: 2 March 2004 / Accepted: 6 May 2004 / Published online: 9 February 2005.

Springer- Verlag London Limited 2005

Abstract

Increasing product complexity, decreasing component size, and using

double-sided boards have made surface mount technology (SMT) based electronics

manufacturing (EM) component more difficult to assemble. This has resulted in the

economic troubleshooting of EM defects being one of the main problems facing all

manufacturers. Although the authors have made significant improvements in the EM

process, it has been shown that the implemented changes in the automated lines have

not yet produced a high enough percentage of reliable finished products. The objective

of this current development is to make a contribution towards these EM processes by

creating an Internet-based intelligent system of circuit board defect detection so that EM

process flaws that necessitate rework operations can be identified prior to

manufacturing runs. With the development of this system, the need to rework the

defective components will be minimized for any assembly line and assembly line

process parameters, which cause some reliability problems (such ass older balls,

insufficient solder at joints, burnt joint connections, bridged leads, voids, skewed leads,

and unformed joints) will be troubleshot directly, and the rework will be greatly reduced

from the EM assembly line. This paper reports the current development and its

structure.

Keywords

Electronics manufacturing

?

Internet

?

Printed circuit board

?

Surface

mount technology

?

User interface

1 Introduction

The trend to high-density packaging in surface mount technology assembly has

highlighted inherent difficulties in the assembly line of these very fine-pitched devices.

A variety of defects is still common in printed circuit board assembly (PCBA)

technology despite all of the improvements made, and rework of PCBA is inevitable

and must be performed manually in PCBA manufacturing floors since the cost of each

component and the PCB itself may be hundreds of dollars. In the last few years, the

number of rework stations available on the market has grown considerably including

automated ones, but there has still been no significant reduction in the number of

defects. In electronics manufacturing, rework is defined as the activity that replaces

defective components with those that are acceptable such that the populated board

performs to specifications. Increasing product complexity, decreasing component size,

and using double-sided boards have made rework more difficult and the economic

reworking of PCBA

is one of the main problems facing PCB manufacturers .PCBA

manufacturing has been relatively improved with fully automated, accurate assembly

machines and the use of robots.

Although significant improvement in automated rework has also been made by one of

the authors, it has been shown that the outcome of the automated rework line has not

produced a high enough reliable yield percentage. The objective of this research project

is to make a contribution towards this surface mount rework y creating a

knowledge-based intelligent system of circuit rd defects so that the defects that

necessitate a rework operation can be detected through the electronics manufacturing

line. With the development of this system, the number of defective boards will be

minimized from the PCBA line and PCBA process parameters that cause joint level

reliability problems will be identified. The causes of these problems will be troubleshot

with the help of the developed online system.

2 Generic overview

High value printed circuit boards used for computer, military ,and telecommunications

applications are a critical mission sensitive eel e m

en

t for the 21st century’s

advanced technological

developments. The growth of small- footprint and small-feature SMT in electronic

components presents enormous technical obstacles to the successful production of such

PCBAs.

Rework refers to the general technical problem of removing and replacing defective

circuit components on a printed circuit board. A variety of different rework methods

have been successfully developed and tested during the last decades of the 20

th

century,

but it has also been proven that none of them has perfectly produced final reliable joint