-
景旺电子
(
深圳
)
有限公司
Kinwong
Electronic
(Shenzhen) Co.,
ltd.
文件类别：
Document Type
文件名：
Document
Title:
铝基板生产作业指导书
Working Instruction of Aluminous PCB
Production
文件编号：
Document No.
版
本
号：
Version No.
TD-ALU-01
A
页
数：
Page
生效日期：
Effective Date
第
5
页
共
18
页
5 of 18 pages
作业指导书
Working
Instruction
1.0
目的
Purpose
规范铝基板批量生产的操作，提升铝基板的品质档次。
To regulate mass production operation
of aluminous PCB and to improve the quality of
aluminous PCB
2.0
铝基板简介
Introduction of Aluminous PCB
2.1
性能和应用
Function and Application
铝基板是一种散热性能良好的绝缘金属基敷铜板
,
其特点在于：
Aluminous
PCB is a kind of insulated metal-based copper
board with high thermal diffusivity. Its
characteristics are as below:
2.1
.1
良好的导热性能有助于元器件的冷却
;
Good heat conductivity helps to cool
components.
2.1.2
较高的绝缘强度能够经受高达
6
KV AC
电压；
High insulated capacity can make
aluminous PCB bear 6KV AC pressure.
由于上述种种优越性能，铝基板被广泛应用于电源控制等方面。
Due to the characteristics above,
aluminous PCB is widely used in the aspect of
power control.
2.2
结构
Structure
2.2.1
一般的金属基板分为三层：线路层、绝缘层和金属基层。
Generally
speaking, aluminous PCB is divided into three
layers: circuit layer, insulated layer & metal
layer.
线路层一般采用电解铜箔，常用厚度有
1OZ
、
2OZ
、
3OZ
< br>、
4OZ
等
4
< br>种；绝缘层一般为填充
了陶瓷的聚合物，其常用厚度为
7
5
?
m
、
15
0
?
m
；金属基层一般有铝基、铜基、
铁基、
CIC
、
CMC
等，常用厚度为
1.0mm
、
1.6mm
、
2.0mm
、
3.2mm;
Circuit layer is commonly used
electrolyzed copper foil with thickness of 1OZ,
2OZ, 3OZ and
4OZ. Insulated layer is
often a kind of polymer full of ceramics with
thickness of 75
?
m
and150
?
m. Metal
layer usually includes Al-based board, Cu-based
board, Te-based board, CIC
and CMC etc.
with thickness of 1.0mm, 1.6mm, 2.0mm and 3.2mm.
2.2.2
为了保护铝面不被擦花、氧化，也有助于生产过程前面工序的控制，一般的铝基板铝面
贴有保护膜；
景旺电子
(
深圳
)
有限公司
Kinwong Electronic
(Shenzhen) Co., ltd.
文件类别：
Document Type
文件名：
Document
Title:
铝基板生产作业指导书
Working Instruction of Aluminous PCB
Production
文件编号：
Document No.
版
本
号：
Version No.
TD-ALU-01
A
页
数：
Page
生效日期：
Effective Date
第
6
页
共
18
页
6 of 18pages
作业指导书
Working
Instruction
In
order
to
avoid
scratches
and
oxidation
of
Al
surface
and
to
control
pre-process
during
production, the Al
surface of Aluminous board is usually pasted with
a layer of protective film.
2.2.3
金属基板有单面、双面之
分。
以
Bergquist
公司提供的
单面铝基板为例，其结构如图所示，
具体参数为：
Metal-based
aluminous board is divided into single-sided one
and double-sided one.
Taking the
single-sided aluminous board supplied
by Bergquist as an example, its structure and
concrete
parameters are as below:
铜箔厚度：
4OZ
绝缘层厚度：
75um
铝基厚度：
1.0mm
、
1.2mm
、
1.6mm
Copper foil thickness: 4OZ
Insulated layer thickness:
75um
Al base thickness:
1.0mm, 1.2mm & 1.6mm
2.3
标准尺寸
Standard Dimension
Bergquist
公司铝基板的标
准尺寸有
18
″
X 24
″
和
16
″
X
19
″两种，其有效利用尺寸
分别为
17
″
X
23
″
和
15
″
X
18
″；我司常用工作板尺寸为
18
″
X 24
″。
The standard
dimensions of Bergquist aluminous boards are
divided into 18
″
X 24
″
and
16
″
X
19
″
with
valid
dimensions
of
17
″
X
23
″
and
15
″
X
18
″
respectively.
The
dimension
of
Kinwong
working board is
18
″
X
24
″
.
注：其它供应商或客户指定之铝基板，根据实际情况而定。
Remark: The
aluminous board offered by other suppliers or
appointed by customers is dependent
on
real situation.
2.4
设计要点
Main Points of Design
为了有效地避免或减少铝基板使用过程中的漏电问题
，在图形设计过程中要保证以下安
全距离：
In
order
to
effectively
avoid
or
decrease
the
creepage
problem
during
aluminous
board
use,
it
is
necessary to keep a safe
distance during pattern design as below:
孔边到线路边缘的距离最小值为
T(T
为板材厚度
)
The minimum distance between hole and
circuit edge is T (t=base material thickness).
板边到线路边缘的距离最小值为
T
The minimum distance between board edge
and circuit edge is T.
孔边到板边的最小距离为
T
The minimum
distance between hole and board edge is T.
景旺电子
(
深圳
)
有限公司
Kinwong
Electronic
(Shenzhen) Co.,
ltd.
文件类别：
Document Type
文件名：
Document
Title:
铝基板生产作业指导书
Working Instruction of Aluminous PCB
Production
文件编号：
Document No.
版
本
号：
Version No.
TD-ALU-01
A
页
数：
Page
生效日期：
Effective Date
第
7
页
共
18
页
7 of 18 pages
作业指导书
Working
Instruction
冲孔最小孔径为
T
The minimum
hole-diameter for punching is T.
倒角圆弧半径最小值为
T
The
minimum semi-diameter of rounding
circular arc is T.
3.0
铝基板制程
< br>喷锡流程：
来料检查→
一次冲
/
钻孔
→图形转移→图形检查→蚀刻→退膜→蚀检→阻焊制作→<
/p>
打定位孔→
字符制作→喷锡→喷锡检查→单面磨板（视客户要求而
定）→
V-CUT/
成型→通断测试
→
高压测试→
FQC
、
FQA
→包装入库
HALS Process
：
IQC<
/p>
→
One-time hole-
punching/drilling
→
Image
Transfer
→
Image Check
< br>→
Etching
→
Film-
stripping
→
Etching
Check
→
Solder
Mask
Making
→
Orientation-hole
Punching
< br>→
Component
Mark Making
→
HALS
→
HAL
S Check
→
Single-side
Scrubbing
（
according to
customer
’
s requirements
）
→
V-CUT/
Mou
lding
→
Open/Short
Test
→
High-pressure Test
→
FQC
、
FQA
→
Packing
OSP
流程：来料检查→一次冲
/
钻孔→图形转移→图形检查→蚀刻→退膜→蚀检→→阻焊制
作→打定位孔→字符制作→
V-CUT/
成型
→测试→
FQC
、
FQA
→
OSP
→
FQC
→包装入库
OSP Process
：
IQC
→
One-
time hole-
punching/drilling
→
Image
Transfer
→
Image Check
< br>→
Etching
→
Film-
stripping
→
Etching
Check
→
Solder
Mask
Making
→
Orientation-hole
punching
< br>→
Component Mark Making
→
V-CUT/
Moulding
→
Test
→
FQC
、<
/p>
FQA
→
OSP
→
FQC
→
Packing
3.1
来料检查
IQC
A
铜面检查：不允许有凹坑、擦花和严重氧化痕迹；
Cu
surface check: Notches, scratches and serious
oxidation are not allowed.
B
保护膜检查：保护膜不应有破损至铝面露出；
Protective film check: Protective film
mustn
’
t be broken with Cu
exposure.
C
厚度检查：按流程卡要求检测板厚、铜厚。
Thickness check: Check board thickness
and Cu thickness according to lot card.
3.2
一
次冲
/
钻
孔
One-time Hole-punching/drilling
A <
/p>
一次冲
/
钻
孔主
要冲管位孔和工艺孔，孔位和孔径均要符合图纸要求；
景旺电
子
(
深圳
)
有
限公司
Kinwong Electronic
(Shenzhen) Co., ltd.
文件类别：
Document Type
文件名：
Document
Title:
铝基板生产作业指导书
Working Instruction of Aluminous PCB
Production
文件编号：
Document No.
版
本
号：
Version No.
TD-ALU-01
A
页
数：
Page
生效日期：
Effective Date
第
8
页
共
18
页
8 of 18 pages
作业指导书
Working
Instruction
One-time
hole-punching/drilling
is
mainly
to
punch
orientation-hole
and
technical
hole.
The
hole-position and hole-
diameter must be consistent with drawing
requirement.
B
冲
/
钻板
方向为从铜面到铝面，可有效避免铝面擦花；
Punching/drilling direction is from Cu
surface to Al surface, which can effectively avoid
scratches of
Al surface.
3.3
图形转移
Image Transfer
A
磨板
Scrubbing
a
为提高干膜和保护膜面的结合力，防止保护膜面干膜脱落，可
轻磨保护膜面；
In order to improve
the combination of dry film & protective film and
to avoid falling off dry film on
the
protective film, it is necessary to lightly scrub
the surface of protective film.
b
不允许有板面氧化和胶渍现象。
Oxidation and left glue stains on the
board surface cannot be allowed.
B
贴膜
Film Pasting
a
干膜种类：
AQ-5038
；
Dry film type:
AQ-5038
b
预烘和贴膜时间间隔要尽量短。
The interval between pre-cure and film-
pasting time should be as short as possible.
C
静置冷却
Placing and
Cooling
为了对位的准确，须将已贴膜的铝基板静置冷却至室温。
In order to assure accurate
registration, it is necessary to place aluminous
board with pasted film for a
while
until it reaches room temperature.
D
曝光
Exposing
a
负片黄菲林；
Negative Yellow Film
b
注意丝印孔对位的准确性。
Pay
attention to the registration accuracy of silk-
screening hole.
E
静置
Placing
线路部分发生光聚反应
,
经
15min
左右充分聚合。
The light-gathering reaction happens at
the circuit part and reaches full aggregation
after 15 minutes.
景旺电子
(
深圳
)
有限公司
Kinwong Electronic
(Shenzhen) Co., ltd.
文件类别：
Document Type
文件名：
Document
Title:
铝基板生产作业指导书
Working Instruction of Aluminous PCB
Production
文件编号：
Document No.
版
本
号：
Version No.
TD-ALU-01
A
页
数：
Page
生效日期：
Effective Date
第
9
页
共
18
页
9 of 18 pages
作业指导书
Working
Instruction
F
显影
Developing
3.4
图形检查
Image Check
A
检查重点在于开路、短路、缺口、显影不净等；
Mainly check open circuit, short
circuit, gap and unclean developing etc.
B
修板时不能用黑油笔，只能用黑油补；
Black oil-pen cannot be used when
mending board but black oil.
3.5
蚀刻
Etching
A
必须在首板试验合格方可批量生产；
It is
obligatory to conduct mass production after the
first batch of boards is confirmed to be
qualified.
B
蚀刻放板时，线路面向下，同时关掉机器的上喷嘴；
Put
the
circuit
side
adown
when
placing
boards
for
etching
and
turn
off
the
spraying
head
on
the
machine at the same
time.
C
不允许有保护膜破损现象，如发现保护膜破损，则应先用皱
纹胶贴好再过机蚀刻；
The dilapidation of
protective film is not allowed and if the
protective film is broken, it should use
adhesive tape to mend it before placing
boards on the etching machine.
D
尽量控制一次蚀刻干净；
Assure one-time
clean etching as possible as it can.
E
图形内任何地方的残铜或绝缘层上的垃圾都不允许用刀片来刮；
Using
knife
to
scrape
off
left
Cu
on
any
part
of
the
pattern
or
the
dirt
on
the
insulated
layer
is
not
allowed.
3.6
退膜
/
清洗
Film-stripping/Cleaning
A <
/p>
退膜不能浸泡在退膜缸中，必须直接过机退膜，一次性退膜干净；
B
退膜过程中残留在板面的药水会影响铝基板成品的耐用程度
，故需对剥膜后的铝基板进行
有效的清洗；
C
退膜干净后的铝基板必须进行烘干处理后方可往下流程；
D
所有铝基板均不能进行手动蚀刻；
E
如有蚀刻不净的板子，可进行快速过机返蚀，蚀刻压力：<
/p>
0.1-0.5kg/cm
2
，蚀刻速度
：
景旺电子
(
深圳
)
有限公司
Kinwong Electronic
(Shenzhen) Co., ltd.
文件类别：
Document Type
文件名：
Document
Title:
铝基板生产作业指导书
Working Instruction of Aluminous PCB
Production
文件编号：
Document No.
版
本
号：
Version No.
TD-ALU-01
A
页
数：
Page
生效日期：
Effective Date
第
10
页
共
18
页
10 of 18 pages
作业指导书
Working
Instruction
3.7
蚀刻检查
Etching Check
5000mm/min
，但返蚀次数最多不可超过
2
次。
A
绝缘层上的任何地方都不允许用刀片来刮；
Using knife to scratch any part of the
insulated layer is not allowed.
B
主要
检查短路、缺口、开路，报废单元不能钻孔，只能用黑油笔打
“
╳
”
；
Mainly
check
short
circuit,
gap,
open
circuit.
Abandoned
unit
mustn
’
t
be
drilled
and
can
only
be
marked with
“
X
”
by
black oil-pen.
3.8
阻焊制作
Solder Mask Making
A
单面磨板（线路面），不允许板面有氧化和胶渍现象；
Single-side scrubbing (circuit side).
Oxidation and glue stains on the board surface are
not allowed.
B
待板子冷却至室温后印阻焊
Print solder mask after the board is
cooled into room temperature.
C
待铝基板冷却至室温后，方可对位曝光；
Register and expose aluminous PCB after
it is cooled into room temperature.
a <
/p>
对位前应认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工；
Before registration, it is
necessary to seriously check if the sensitization
oil accumulates on the board
surface or
is uneven. If there is a lot of sensitization oil
on the board surface, it must re-process such
boards in time.
b
对位时应注意菲林与板面
MARK
点的同心度；
During registration, it is
necessary to pay attention to the concentricity of
the film and mark point.
D
曝光；
Exposing
E
显影；
Developing
F
检查：重点检查显影不净和绿油上焊盘；
Check: Mainly check unclean
developing and solder mask on the PAD.
G
无特殊要求的板在显影后须撕掉铝面保护膜，铝面不能有胶
渍和保护膜残留；
I t
must rip off the protective film on the Al surface
after developing for unspecialized boards. Glue
stains and protective film leftover on
the Al surface are not allowed.
注：若有特殊要
求，则在显影后及全制程都不可撕掉铝面保护膜；
景旺电子<
/p>
(
深圳
)
有限公
司
Kinwong Electronic
(Shenzhen) Co., ltd.
文件类别：
Document Type
文件名：
Document
Title:
铝基板生产作业指导书
Working Instruction of Aluminous PCB
Production
文件编号：
Document No.
版
本
号：
Version No.
TD-ALU-01
A
页
数：
Page
生效日期：
Effective Date
第
11
页
共
18
页
11 of 18 pages
作业指导书
Working
Instruction
Remark:
If
the
customer
has
special
requirements,
the
protective
film
mustn
’
t
be
ripped
off
after
developing even during
the whole production.
H
返洗绿油板返洗绿油前不能撕掉铝面保护膜，并检查有无破
损，如有必须用皱纹胶纸贴好。
The
protective film cannot be ripped off before
washing off solder mask for re-process and should
be
checked if is broken. If the
protective film is broken, it must be mended with
adhesive tape.
I
如下工序为打定位孔工序必须先固化阻焊后在送板下工序。
3.9
打定位孔
Orientation-hole Punching
A
用层压打靶在做好的线路相应靶位图上打靶。
Punch
orientation-hole
at
corresponding
position
of
the
board
with
finished
circuits
by
layer-pressing punching
B
孔位偏差≤
0.075mm
，孔径
3.175mm
。
The hole-position tolerance is
≤
0.075mm and the hole-
diameter tolerance is 3.175mm.
3.10
字符制作
< br>(
根据
MI
要求而定
) Component Mark Making(based on the requirement of MI)
A
每印一块工作板后都需认真自检
，合格后再继续印刷，不合格板需分开及时返工；
Conduct self-
check for every printed working board and continue
printing when the previous one is
confirmed
to
be
qualified.
Unqualified
boards
must
be
separated
from
qualified
ones
and
be
re-
processed in time.
B
字符不允许有模糊、重影、残缺、渗油等现象；
Component mark
mustn
’
t be ambiguous,
broken, oil-seeped or with ghost image.
3.11
喷锡
HALS
A
锡炉温度控制在
240~260<
/p>
℃；
The Tin-oven
temperature is controlled within
240~260
℃
.
B
喷锡后要充分冷却后方可进行后处理；
Conduct post-
treating when the board is fully cooled after
HALS.
C
后处理的热水洗段要将板面充分清洗干净，防止板面哑色；
Completely
clean the board surface at the hot-water washing
section of the post-treating to avoid dim
color of the board surface.
3.12
喷锡检查
HALS Check