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SMT
回流焊工艺中英文对照
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1. Fundamentals of Solders and
Soldering
(焊料及焊接基础知识)
Soldering
Theory
(焊接理论)
Microstructure and
Soldering
(显微结构及焊接)
Effect of Elemental Constituents on
Wetting
(焊料成分对润湿的影响)
Effect of Impurities on
Soldering
(杂质对焊接的影响)
2. Solder Paste
Technology
(焊膏工艺)
Solder Powder (
锡粉
)
Solder Paste
Rheology
(锡膏流变学)
Solder Paste Composition &
Manufacturing
(锡膏成分和制造)
3. SMT Problems Occurred Prior to Reflo
w
(回流前
SMT
问题)
Flux
Separation
(助焊剂分离
)
Paste
Hardening
(焊膏硬化)
Poor Stencil
Life
(网板寿命问题
)
Poor
Print Thickness
(印刷厚度不理想)
Poor Paste Release From
Squeegee
(锡膏脱离刮刀问题)
Smear
(印锡模糊)
Insufficiency
(印锡
不足)
Needle
Clogging
(针孔堵塞)
Slump
(塌落)
Low Tack
(低粘性)
Short Tack Time
(粘性时间短)
4. SMT
Problems Occurred During Reflow
(回流过程中的<
/p>
SMT
问题)
Cold Joints
(冷焊)
Nonwetting
(不润湿)
Dewetting
(反润湿)
Leaching
(浸析)
Intermetallics
(金属互化物)
Tombstoning
(立碑)
Skewing
(歪斜)
Wicking
(焊料上吸)
Bridging
(桥连)
Voiding
(空洞)
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