-
免洗无铅锡膏
产品资料
No Clean
Le
a
d-Free Solder Paste
LF-JPS-855-AA
Sn96.5Ag3.0Cu0.5+Ni
锡膏焊接被视为电子加工业不可代替的材料之一
,
但一
般的锡膏都是含有铅的成份
,
它会随时
间慢慢的会溶解於酸水中而变成有毒物质。
当我们想到大自然会受到铅毒的污染
,
而最终会影
响到人类基本的健康问题的时候<
/p>
,
无铅锡膏的发展与使用就成为一项重要话题了。
Soldering
is
positioned
as
an
indispensable
tool
for
the
current
production
of
the
electronics devices. But
“
Sn-Pb
solder
”
contains lead
(called Pb hereafter). Pb for
its
character dissolves gradually into acidity water,
becoming as a poisonous soluble
lead
compound. When we consider a contamination of
natural world and intermix of
Pb
into
human
body,
a
development
of
the
Pb-free
soldering
materials
is
an
important
issue.
无铅锡膏
SOLDER PASTE
1
、产品特性
Characteristics of Product
产品分类
Product
classification
LF-
JPS-855-AA
金
属
成
份
Alloy Composition
Sn/Ag3.0/Cu0.5+Ni
锡粉颗粒大小
Particle
size of Solder Powder
25~45
?
m
溶点
M.P.
217
℃
松香比例
Contents of
Flux
10%
粘度
Viscosity
160-210 Pa . S
保用期
Quality
guarantee period
产品若存放於
5
℃
-10
℃
的环境中有效期为
180
天．
< br>
180days after
manufacture if stored in hermetically sealed
conditions at temperature
below
5
℃
-10
℃
2
、优点
Major Features
．良好焊接效果
．
Excellent in solderability.
．保持超过
24
小时的粘力效果
．
Keep
the stability in tackiness force of solder paste
over 24hr.
．良好印刷时间
．
No change in viscosity
during continuous printing
．残留物为无色透明状
．
It is almost colorless so
the appearance after soldering is good.
3
、物理特性。
Physical Properties
流动特性
Fluidity
Characteristics
触变指数
0.6
0.6
Thixotropy index
温度与粘度实验表
Temperature Dependence
以下数据记
录是在每分钟旋转
10
周速度连续每
3
分钟用
PCU
型粘度测试仪
(Malcom)
所做的
记录。
< br>
Value three minutes after 10rpm was
measured by using a viscometer, PCU
type(spiral
type) manufactured by Malcom. The results are
shown in Fig.1. Control
operating temperature since the
difference in viscosity affects printability.
温度与粘度的关系图
Fig.1. Relationship between temperature
and viscosity
malcom
公司
PCU
型粘度机
viscosity : PCU type manufactured by
Malcom
Stability in
Tackiness force
粘力稳定度
Fig.2.
shows the stability in tackiness force of solder
paste.
粘力的稳定记录表
Fig2
Stability in tackiness
force
脱解速度：每秒钟
10
毫米加压时间
0.2
秒，加压速度：每
秒钟
2
毫米压力：
0.5N
Peeling speed :10.0mm/s Press time: 0.2
s
Press speed :2.0mm/s
Press force :0.5N
4
、印刷性能
Printability
印刷稳定性
Stability
in viscosity during continuous printing
印刷稳定性一般是因为不同型号的锡膏而有所不同，因为印刷的最终效果记录与锡膏本身於
不同印刷速率与环境中粘度的变化有密切的关系。故此，以下图表是在铜板每印刷
2
50
次作
记录所得，而资料显示锡桨在不同的印刷过程中，粘度
表现良好。
Depending on the type
of solder paste or the condition of printing, the
viscosity of